Publication in conference proceedings
THz packaging solution for low cost si-based 40 Gb/s wireless link system
Elsa Lacombe (Lacombe, E.); Frederic Gianesello (Gianesello, F.); Cyril Luxey (Luxey, C.); Cedric Durand (Durand, C.); Diane Titz (Titz, D.); Jorge Rodrigues da Costa (Costa, J. R.); Carlos Fernandez (Fernandes, C. A.); Carlos del Río Bocio (Del-Río, C.); Guillaume Ducournau (Ducournau, G.); Heiko Gulan (Gulan, H.); Thomas Zwick (Zwick, T.); et al.
12th European Conference on Antennas and Propagation, EuCAP 2018
Year (definitive publication)
2018
Language
English
Country
United Kingdom
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(Last checked: 2024-12-26 08:42)

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Abstract
This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached.
Acknowledgements
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Keywords
Silicon photonic IC,Low-cost antenna in package
Funding Records
Funding Reference Funding Entity
UID/EEA/50008/2013 Fundação para a Ciência e a Tecnologia
Publication Identifiers
ci-pub-53393
http://hdl.handle.net/10071/17036
Other Publication Details
2018
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Yes
Both (printed and digital)
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EurAAP
Londres
Conference
International
2018
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