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Bisognin, A., Titz, D., Luxe, C., Jacquemod, G., Pilard, R., Gianesello, F....Devillers, F. (2015). Millimeter-wave antenna-in-package solutions for WiGig and backhaul applications. In Gareth A Conway, William G. Scanlon (Ed.), Proceedings of 2015 International Workshop on Antenna Technology (iWAT). (pp. 52-55). Seoul: IEEE.

A. Bisognin et al.,  "Millimeter-wave antenna-in-package solutions for WiGig and backhaul applications", in Proc. of 2015 Int. Workshop on Antenna Technology (iWAT), Gareth A Conway, William G. Scanlon, Ed., Seoul, IEEE, 2015, vol. 1, pp. 52-55

@inproceedings{bisognin2015_1714628378980,
	author = "Bisognin, A. and Titz, D. and Luxe, C. and Jacquemod, G. and Pilard, R. and Gianesello, F. and Gloria, D. and Laporte, C. and Ezzedine, H. and Costa, J.  and Lima, E. and Fernandes, C. and Devillers, F.",
	title = "Millimeter-wave antenna-in-package solutions for WiGig and backhaul applications",
	booktitle = "Proceedings of 2015 International Workshop on Antenna Technology (iWAT)",
	year = "2015",
	editor = "Gareth A Conway, William G. Scanlon",
	volume = "1",
	number = "",
	series = "",
	doi = "10.1109/IWAT.2015.7365310",
	pages = "52-55",
	publisher = "IEEE",
	address = "Seoul",
	organization = "",
	url = "http://ieeexplore.ieee.org/document/7365310/"
}

TY  - CPAPER
TI  - Millimeter-wave antenna-in-package solutions for WiGig and backhaul applications
T2  - Proceedings of 2015 International Workshop on Antenna Technology (iWAT)
VL  - 1
AU  - Bisognin, A.
AU  - Titz, D.
AU  - Luxe, C.
AU  - Jacquemod, G.
AU  - Pilard, R.
AU  - Gianesello, F.
AU  - Gloria, D.
AU  - Laporte, C.
AU  - Ezzedine, H.
AU  - Costa, J. 
AU  - Lima, E.
AU  - Fernandes, C.
AU  - Devillers, F.
PY  - 2015
SP  - 52-55
DO  - 10.1109/IWAT.2015.7365310
CY  - Seoul
UR  - http://ieeexplore.ieee.org/document/7365310/
AB  - This paper provides an overview of the authors' research work to develop low-cost antennas and packaging technologies for 60GHz and 120GHz high speed data rate communications. First, a WiGig module designed in a low cost High-Density-Interconnect organic packaging technology is briefly depicted. The linearly polarized antennas integrated in a 12×12×0.5 mm3 ball-grid-array module exhibit a realized gain higher than 5 dBi over the entire WiGig band. Then, in order to address the Millimeter-Wave backhaul applications while leveraging the previous achievement, a lens-casing solution is proposed. The achievable performance with a plastic (ABS-M30) lens manufactured using a rapid 3D printing prototyping technique is validated at both 60 GHz and 120 GHz.
ER  -