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Dolatsha, N., Grave, B., Sawaby, M., Chen, C., Babveyh, A., Kananian, S....Arbabian, A. (2017). A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m. In Fujino, L. C. (Ed.), 2017 IEEE International Solid-State Circuits Conference (ISSCC). (pp. 306-307). San Francisco, CA, USA: IEEE.

N. Dolatsha et al.,  "A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m", in 2017 IEEE Int. Solid-State Circuits Conf. (ISSCC), Fujino, L. C., Ed., San Francisco, CA, USA, IEEE, 2017, vol. 60, pp. 306-307

@inproceedings{dolatsha2017_1730766068515,
	author = "Dolatsha, N. and Grave, B. and Sawaby, M. and Chen, C. and Babveyh, A. and Kananian, S. and Bisognin, A. and Luxey, C. and Gianesello, F. and Costa, J. and Fernandes, C. and Arbabian, A.",
	title = "A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m",
	booktitle = "2017 IEEE International Solid-State Circuits Conference (ISSCC)",
	year = "2017",
	editor = "Fujino, L. C.",
	volume = "60",
	number = "",
	series = "",
	doi = "10.1109/ISSCC.2017.7870383",
	pages = "306-307",
	publisher = "IEEE",
	address = "San Francisco, CA, USA",
	organization = "IEEE; Univ Penn, Inst Elect & Elect Engineers",
	url = "https://ieeexplore.ieee.org/xpl/conhome/7866667/proceeding"
}

TY  - CPAPER
TI  - A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m
T2  - 2017 IEEE International Solid-State Circuits Conference (ISSCC)
VL  - 60
AU  - Dolatsha, N.
AU  - Grave, B.
AU  - Sawaby, M.
AU  - Chen, C.
AU  - Babveyh, A.
AU  - Kananian, S.
AU  - Bisognin, A.
AU  - Luxey, C.
AU  - Gianesello, F.
AU  - Costa, J.
AU  - Fernandes, C.
AU  - Arbabian, A.
PY  - 2017
SP  - 306-307
DO  - 10.1109/ISSCC.2017.7870383
CY  - San Francisco, CA, USA
UR  - https://ieeexplore.ieee.org/xpl/conhome/7866667/proceeding
AB  - Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions.
ER  -