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Descrição Detalhada da Publicação
A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m
2017 IEEE International Solid-State Circuits Conference (ISSCC)
Ano (publicação definitiva)
2017
Língua
Inglês
País
Estados Unidos da América
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Abstract/Resumo
Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions.
Agradecimentos/Acknowledgements
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Palavras-chave
Classificação Fields of Science and Technology
- Ciências Físicas - Ciências Naturais
Registos de financiamentos
Referência de financiamento | Entidade Financiadora |
---|---|
CNS-1518632 | National Science Foundation |
UID/EEA/50008/2013 | Fundação para a Ciência e a Tecnologia |
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