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Publication Detailed Description
A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m
2017 IEEE International Solid-State Circuits Conference (ISSCC)
Year (definitive publication)
2017
Language
English
Country
United States of America
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Abstract
Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions.
Acknowledgements
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Keywords
Fields of Science and Technology Classification
- Physical Sciences - Natural Sciences
Funding Records
Funding Reference | Funding Entity |
---|---|
CNS-1518632 | National Science Foundation |
UID/EEA/50008/2013 | Fundação para a Ciência e a Tecnologia |
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